Analysis of a Mechanical Punching Process to Create Registration Holes on a Continuous Roll-to-Roll Flexible Electronics Substrates Using SPC Techniques

Analysis of a Mechanical Punching Process to Create Registration Holes on a Continuous Roll-to-Roll Flexible Electronics Substrates Using SPC Techniques

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The objective of this research endeavor is to analyze and attempt to improve the mechanical hole-punching process, using Statistical Process Control (SPC) techniques. Essentially, this research reports the process capability indices (PCIs) of the punching process and suggests alternative avenues to creating holes for substrate registration.3.4.2 Initial Measuring Approach with Reflex CMM 42 3.4.3 Subsequent Measuring Approach with Reflex CMM 43 ... 62 4.3 Mitutoyo Quick Vision (QV) Data Analysis 69 4.3.1 Repeatability of QV System Software Program 69 4.3.2 Mechanicalanbsp;...


Title:Analysis of a Mechanical Punching Process to Create Registration Holes on a Continuous Roll-to-Roll Flexible Electronics Substrates Using SPC Techniques
Author: Denisse E. Yepez
Publisher:ProQuest - 2008
ISBN-13:

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